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All papers authored by Jae-Phil Shim

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2018 Seong Kwang Kim, Jae-Phil Shim

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, Dae-Myeong Geum, Jaewon Kim, Chang Zoo Kim, Han-Sung Kim

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, Jin Dong Song, Sung-Jin Choi

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, Won Jun Choi, Hyung-Jun Kim, Dong Myong Kim

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, Sanghyeon Kim

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Impact of Ground Plane Doping and Bottom-Gate Biasing on Electrical Properties in In0.53Ga0.47As-OI MOSFETs and Donor Wafer Reusability Toward Monolithic 3-D Integration With In0.53Ga0.47As Channel

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This paper was not found in any repository, but could be made available legally by the author.

Jae-Phil Shim

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, Gunwu Ju, Hyeong-Rak Lim, Seong Kwang Kim, Jae-Hoon Han, Hyung-Jun Kim, Sang-Hyeon Kim

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Low-Temperature Material Stacking of Ultrathin Body Ge (110)-on-Insulator Structure via Wafer Bonding and Epitaxial Liftoff From III–V Templates

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This paper was not found in any repository, but could be made available legally by the author.

Gunwu Ju, Hansung Kim

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, Jae-Phil Shim

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, Seong Kwang Kim, Byeong-Hyeon Lee, Sung Ok Won, Sanghyeon Kim, Hyung-Jun Kim

Anisotropic surface morphology in a tensile-strained InAlAs layer grown on InP(100) substrates

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Sang-Hyeon Kim

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, Subin Lee, Ho-Sung Kim, Pavlo Bidenko

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, Seong-Kwang Kim, Chang-Mo Kang, Jae-Phil Shim

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, Dong-Seon Lee, Dae-Myeong Geum, Jin-Dong Song, Gunwu Ju, Won Jun Choi, Han-Sung Kim, Hyung-Jun Kim, Hee-Jeong Lim and 2 other authors

Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III–V and Ge Materials

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This paper was not found in any repository, but could be made available legally by the author.

2017 Seong Kwang Kim, Jae-Phil Shim

ORCID

, Dae-Myeong Geum, Chang Zoo Kim, Han-Sung Kim

ORCID

, Jin Dong Song, Sung-Jin Choi

ORCID

ORCID

, Won Jun Choi, Hyung-Jun Kim, Dong Myong Kim

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, Sanghyeon Kim

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Fabrication of InGaAs-on-Insulator Substrates Using Direct Wafer-Bonding and Epitaxial Lift-Off Techniques

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