Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Electron Devices, 9(64), p. 3601-3608
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Fabrication of InGaAs-on-Insulator Substrates Using Direct Wafer-Bonding and Epitaxial Lift-Off Techniques
Journal article published in 2017 by
Seong Kwang Kim,
Jae-Phil Shim 
,
Dae-Myeong Geum,
Chang Zoo Kim,
Han-Sung Kim ,
Jin Dong Song,
Sung-Jin Choi ,
Dae Hwan Kim ,
Won Jun Choi,
Hyung-Jun Kim,
Dong Myong Kim ,
Sanghyeon Kim
,
Dae-Myeong Geum,
Chang Zoo Kim,
Han-Sung Kim ,
Jin Dong Song,
Sung-Jin Choi ,
Dae Hwan Kim ,
Won Jun Choi,
Hyung-Jun Kim,
Dong Myong Kim ,
Sanghyeon Kim
This paper was not found in any repository, but could be made available legally by the author.
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