Published in
Institute of Electrical and Electronics Engineers, IEEE Journal of the Electron Devices Society, (6), p. 579-587, 2018
DOI: 10.1109/jeds.2018.2802840
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Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III–V and Ge Materials
Journal article published in 2018 by
Sang-Hyeon Kim 
,
Subin Lee,
Ho-Sung Kim,
Pavlo Bidenko ,
Seong-Kwang Kim,
Chang-Mo Kang,
Jae-Phil Shim ,
Dong-Seon Lee,
Dae-Myeong Geum,
Jin-Dong Song,
Gunwu Ju,
Won Jun Choi,
Han-Sung Kim,
Hyung-Jun Kim,
Hee-Jeong Lim
and other authors.
,
Subin Lee,
Ho-Sung Kim,
Pavlo Bidenko ,
Seong-Kwang Kim,
Chang-Mo Kang,
Jae-Phil Shim ,
Dong-Seon Lee,
Dae-Myeong Geum,
Jin-Dong Song,
Gunwu Ju,
Won Jun Choi,
Han-Sung Kim,
Hyung-Jun Kim,
Hee-Jeong Lim
and other authors.
This paper is made freely available by the publisher.
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