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All papers authored by Jinhui Li

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2024 Fangcheng Wang

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, Qiang Liu, Jinhui Li

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, Guoping Zhang

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, Rong Sun

Oriented design of wafer-level stacking structures to enhance reliability of laser debonding of thin devices

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Shan Huang, Yao Zhang, Xingwang Lai, Xialei Lv, Jinhui Li

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, Siyao Qiu, Guoping Zhang

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, Rong Sun

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A comprehensive study on the effect of molecular chain flexibility on the low-temperature curing ability of polyimides

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2023 Shan Huang, Xialei Lv, Yao Zhang, Siyao Qiu, Jinhui Li

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, Huiming Yin, Guoping Zhang

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, Rong Sun

Exploring the Impact of Blend and Graft of Quinoline Derivative in Low‐Temperature Curable Polyimides

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Jialin Zhang, Xingwang Lai, Jinhui Li

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, Tao Wang, Liang Shan, Fangfang Niu, Guoping Zhang

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, Rong Sun

Comprehensive properties study of polyimide with fluorinated nanofillers

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Shan Huang, Xialei Lv, Yao Zhang, Jinhui Li

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, Shilu Zhou, Siyao Qiu, Zimeng He, Tao Wang, Guoping Zhang

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, Rong Sun

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Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine

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Xialei Lv, Shan Huang, Zimeng He, Jinhui Li

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, Siyao Qiu, Tao Wang, Yun Bai, Yao Zhang, Guoping Zhang

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, Rong Sun

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High-performance low temperature curable copolyimidesviamultidimensional modulation in alkaline environment and electronic effects of monomers

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Yao Zhang, Shan Huang, Xialei Lv, Kuangyu Wang, Huimin Yin, Siyao Qiu, Jinhui Li

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, Guoping Zhang

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, Rong Sun

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Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups

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2022 Jialin Zhang, Yuying Sui, Jinhui Li

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, Liang Shan, Fangfang Niu, Guoping Zhang

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, Rong Sun

Low‐dielectric and low‐temperature curable fluorinated nano carbon/polyimide composites with 6‐aminoquinoline for end capping

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Da Huang

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, Jinhui Li

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, Fangcheng Wang, Kang Li, Qiang Liu, Huimin Yin, Guoping Zhang

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, Rong Sun

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Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

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Jinshan Liu

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, Jinhui Li

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, Tao Wang, Dongxu Huang, Zhipeng Li, Ao Zhong, Wen Liu, Yuying Sui, Qiang Liu, Fangfang Niu, Guoping Zhang, Rong Sun

Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package

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Ao Zhong, Jinhui Li

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, Guoping Zhang

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, Rong Sun

Adhesion and Interface Studies of the Structure‐Controlled Polyimide with Smooth Copper for High‐Frequency Communication

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Tao Wang, Jinhui Li

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, Fangfang Niu, Ao Zhong, Jinshan Liu

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, Wen Liu, Liang Shan, Guoping Zhang, Rong Sun, Ching-Ping Wong

Low-temperature curable and low-dielectric polyimide nanocomposites using aminoquinoline-functionalized graphene oxide Nanosheets

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2021 Changqing Li, Yunxia Wang, Yuyang Yin, Yingying Li, Jinhui Li

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, Deliang Sun, Jibao Lu, Guoping Zhang, Rong Sun

A comprehensive study of pyrazine-contained and low-temperature curable polyimide

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Yuying Sui, Jinhui Li

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, Tao Wang, Liang Shan, Qiang Liu, Guoping Zhang

Low temperature curable polyimides for advanced package application

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Ao Zhong, Jinhui Li

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, Liang Shan, Qiang Liu, Guoping Zhang, Rong Sun

Low CTE Polyimide for Advanced Package Application

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Rui Xuan

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, Jinhui Li

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, Dongxu Huang, Tao Wang, Bo Zhang, Fangfang Niu

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, Guoping Zhang, Rong Sun, Ching-Ping Wong

Stretchable and self-healable polyelectrolytes for flexible and sustainable supercapacitor

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Yuying Sui, Jinhui Li

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, Tao Wang, Deliang Sun, Chao Huang, Fan Zhang, Liang Shan, Fangfang Niu, Guoping Zhang, Rong Sun

Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

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Dongxu Huang, Mingqi Huang, Deliang Sun, Bincan Liu, Rui Xuan, Jinshan Liu

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, Rong Sun, Jinhui Li

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, Guoping Zhang, Daquan Yu

Selective Metallization of Glass with Improved Adhesive Layer and Optional Hydrophobic Surface

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Jinhui Li

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, Guoping Zhang

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, Rong Sun

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, Derek Ho

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Natively stretchable micro-supercapacitors based on a PEDOT:PSS hydrogel

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2020 Ao Zhong, Jinhui Li

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, Yu Zhang, Fan Zhang, Tao Wang, Guoping Zhang

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, Rong Sun, Ching-Ping Wong

Low temperature microwave fabrication of three-dimensional graphene/polyimide foams with flexibility strain responsivity

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