Published in
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021
DOI: 10.1109/edtm50988.2021.9420824
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Low temperature curable polyimides for advanced package application
Proceedings article published in 2021 by
Yuying Sui,
Jinhui Li 
,
Tao Wang,
Liang Shan,
Qiang Liu,
Guoping Zhang
,
Tao Wang,
Liang Shan,
Qiang Liu,
Guoping Zhang
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