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Royal Society of Chemistry, Polymer Chemistry, 33(14), p. 3862-3871, 2023

DOI: 10.1039/d3py00773a

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Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups

Journal article published in 2023 by Yao Zhang, Shan Huang, Xialei Lv, Kuangyu Wang, Huimin Yin, Siyao Qiu, Jinhui Li ORCID, Guoping Zhang ORCID, Rong Sun ORCID
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

Fan-out wafer-level packaging (FOWLP) urgently demands low dielectric constant and dissipation factor interlayer dielectric materials to mitigate high transmission losses at high frequencies.