Published in
Elsevier, Optics and Laser Technology, (169), p. 110169, 2024
DOI: 10.1016/j.optlastec.2023.110169
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Oriented design of wafer-level stacking structures to enhance reliability of laser debonding of thin devices
Journal article published in 2024 by
Fangcheng Wang 
,
Qiang Liu,
Jinhui Li ,
Mingqi Huang ,
Wenxue Dai ,
Xuefan Wang ,
Guoping Zhang ,
Rong Sun
,
Qiang Liu,
Jinhui Li ,
Mingqi Huang ,
Wenxue Dai ,
Xuefan Wang ,
Guoping Zhang ,
Rong Sun
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