Jinhui Li
0000-0003-0307-872X
City University of Hong Kong
74 papers found
Refreshing results…
Oriented design of wafer-level stacking structures to enhance reliability of laser debonding of thin devices
A comprehensive study on the effect of molecular chain flexibility on the low-temperature curing ability of polyimides
Exploring the Impact of Blend and Graft of Quinoline Derivative in Low‐Temperature Curable Polyimides
Comprehensive properties study of polyimide with fluorinated nanofillers
Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine
High-performance low temperature curable copolyimidesviamultidimensional modulation in alkaline environment and electronic effects of monomers
Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups
Low‐dielectric and low‐temperature curable fluorinated nano carbon/polyimide composites with 6‐aminoquinoline for end capping
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package
Adhesion and Interface Studies of the Structure‐Controlled Polyimide with Smooth Copper for High‐Frequency Communication
Low-temperature curable and low-dielectric polyimide nanocomposites using aminoquinoline-functionalized graphene oxide Nanosheets
A comprehensive study of pyrazine-contained and low-temperature curable polyimide
Low temperature curable polyimides for advanced package application
Low CTE Polyimide for Advanced Package Application
Stretchable and self-healable polyelectrolytes for flexible and sustainable supercapacitor
Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole
Selective Metallization of Glass with Improved Adhesive Layer and Optional Hydrophobic Surface
Natively stretchable micro-supercapacitors based on a PEDOT:PSS hydrogel
Low temperature microwave fabrication of three-dimensional graphene/polyimide foams with flexibility strain responsivity
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