Jinshan Liu
0000-0001-6737-5227
6 papers found
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Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package
Low-temperature curable and low-dielectric polyimide nanocomposites using aminoquinoline-functionalized graphene oxide Nanosheets
Exploration of the synthesis method of quaternary copolymerized thermoplastic polyimide
Synthesis and properties study of a thermoplastic polyimide with high glass transition temperature for wafer level package
Selective Metallization of Glass with Improved Adhesive Layer and Optional Hydrophobic Surface
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