Takafumi Fukushima

Papers authored by Takafumi Fukushima

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2018 M. Murugesan, T. Fukushima

, J. C. Bea, H. Hashimoto, M. Koyanagi

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal

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This paper is made freely available by the publisher.

Hisashi Kino, Takafumi Fukushima

, Tetsu Tanaka

Study of Al-doped ZnO Transparent Stimulus Electrode for Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip

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2017 Hideto Hashiguchi

, Takafumi Fukushima

, Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration

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This paper was not found in any repository; the policy of its publisher is unknown or unclear.

Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima

, Koji Kiyoyama, Tetsu Tanaka

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip

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Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima

, Tetsu Tanaka

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current

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Takafumi Fukushima

, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration

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Adeel A. Bajwa, SivaChandra Jangam, Saptadeep Pal, Niteesh Marathe, Tingyu Bai, Takafumi Fukushima

, Mark Goorsky, Subramanian S. Iyer

Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding

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M. Murugesan, T. Fukushima

, K. Mori, H. Hashimoto, Jichel Bea, M. Koyanagi

Feasibility study on ultrafine-pitch Cu-Cu bonding using directed self-assembly (DSA)

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M. Murugesan, T. Fukushima

, M. Koyanagi

Temporary Bonding and De-Bonding for Multichip-to-Wafer 3D Integration Process Using Spin-on Glass and Hydrogenated Amorphous Si

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Hisashi Kino, Takafumi Fukushima

, Tetsu Tanaka

Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE

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Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima

, Tetsu Tanaka

Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission

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Takafumi Fukushima

, Arsalan Alam, Zhe Wan, Siva C. Jangam, Saptadeep Pal, Goutham Ezhilarasu, Adeel Bajwa, Subramanian S. Iyer

“FlexTrate ^TM” — Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP

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Murugesan Mariappan, JiChel Bea, Takafumi Fukushima

, Eiji Ikenaga, Hiroshi Nohira, Mitsumasa Koyanagi

Improving the barrier ability of Ti in Cu through-silicon vias through vacuum annealing

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Takumi Morikawa, Takuya Harashima, Hisashi Kino, Takafumi Fukushima

, Tetsu Tanaka

Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber

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Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima

, Tetsu Tanaka

Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces

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T. Fukushima

, A. Bajwa, S. S. Iyer

Heterogeneous integration with high-performance and scalable substrates: Si-IF (Silicon Interconnect Fabric) and FlexTrate™

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2016 Takafumi Fukushima

, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

New concept of TSV formation methodology using Directed Self-Assembly (DSA)

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Murugesan Mariappan, JiChel Bea, Takafumi Fukushima

, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology

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Kangwook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima

, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications

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Hisashi Kino, Takafumi Fukushima

, Tetsu Tanaka

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler

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Papers authored by Takafumi Fukushima