Published in
Royal Society of Chemistry, Nanoscale, 34(9), p. 12524-12532
DOI: 10.1039/c7nr03803h
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Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology
Journal article published in 2017 by
Zhiran Yi 
,
Yu Lei,
Xianyun Zhang ,
Yining Chen,
Jianjun Guo ,
Gaojie Xu,
Min-Feng Yu,
Ping Cui
,
Yu Lei,
Xianyun Zhang ,
Yining Chen,
Jianjun Guo ,
Gaojie Xu,
Min-Feng Yu,
Ping Cui
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Abstract
The ultralow stiffness of copper microhelices fabricated by a MCED direct-writing method was studied by the electrically induced quasi-static and dynamic electromechanical resonance technique.