Published in

SpringerOpen, Nanoscale Research Letters, 1(7), 2012

DOI: 10.1186/1556-276x-7-183

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Applications of multi-walled carbon nanotube in electronic packaging

Journal article published in 2012 by Cher Ming Tan ORCID, Charles Baudot, Yongdian Han, Hongyang Jing
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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Abstract

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.