Published in
Elsevier, Microelectronics Reliability, 9-11(50), p. 1327-1331, 2010
DOI: 10.1016/j.microrel.2010.07.111
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Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model
Journal article published in 2010 by
Feifei He,
Cher Ming Tan 
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