Published in
2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
DOI: 10.1109/ectc.2015.7159872
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Fabricating polymer insulation layer by spin-coating for through silicon vias
Proceedings article published in 2015 by
Guoping Zhang,
Kun Jiang,
Qiang Liu,
Jinhui Li 
,
Rong Sun,
S. W. Ricky Lee,
C. P. Wong
,
Rong Sun,
S. W. Ricky Lee,
C. P. Wong
This paper was not found in any repository, but could be made available legally by the author.
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