Published in
Royal Society of Chemistry, Nanoscale, 16(7), p. 7368-7377, 2015
DOI: 10.1039/c5nr00312a
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Robust Ag nanoplate ink for flexible electronics packaging
Journal article published in 2015 by
Ruo-Zhou Li,
Anming Hu,
Denzel Bridges,
Tong Zhang,
Ken D. Oakes,
Rui Peng,
Uma Tumuluri,
Zili Wu 
,
Zhili Feng
,
Zhili Feng
This paper is available in a repository.
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Abstract
We develop an innovative bonding using Ag nanoplates via photonic sintering with enhanced mechanical strength and anisotropic resistivity.