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2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

DOI: 10.1109/prime.2015.7251406

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Energy-band parameter of atomic layer deposited Al2O3 & sulphur passivated molecular beam epitaxially grown (110) In0.53Ga0.47As surfaces

This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

Based on sulphur passivation (10% (NH 4) 2 S, 20min), the interface of MOS capacitors between atomic-layer-deposited Al 2 O 3 and (110)-oriented p-type In 0.53 Ga 0.47 As layers indicate the capability of Fermi level movement and minority carrier inversion. C ox has effectively extracted by G m / &-dC/d. Forming gas annealing (N 2 :H 2 5%:95% at 350 o C, 30min) improves minority carrier response and the interface trap density around the midgap estimated to be 4.4x10 12 (1.6x10 12) cm-2 eV-1 before (and after) FGA. Moreover, Fowler-Nordheim (FN) tunneling current provides the conduction band offset at the surface between Al 2 O 3 and In 0.53 Ga 0.47 As (110)-oriented layer is ~1.81eV and the barrier height is estimated to be the same after FGA. Finally, the band parameter of Al 2 O 3 and In 0.53 Ga 0.47 As (110)-oriented layer has been firstly reported Keywords—MOSCAPs; band parameter; Sulfur passivation; (110)-oriented; FGA; In 0.53 Ga 0.47 As (key words)