Royal Society of Chemistry, Materials Chemistry Frontiers, 23(7), p. 6130-6140, 2023
DOI: 10.1039/d3qm00831b
Full text: Unavailable
To avoid the interlayer erosion challenge in the IJP process and direct patterning process of the QD emissive layer (EML), cross-linking strategies have been introduced to construct solvent-resistant films (hole transport layers or QD EMLs) upon exposure to heat or light.