Francesco Iannuzzo
www.en.aau.dk
0000-0003-3949-2172
Aalborg University
211 papers found
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Impact of Repetitive Short-Circuit Tests on the Normal Operation of SiC MOSFETs Considering Case Temperature Influence
Lifetime Analysis of Metallized Polypropylene Capacitors in Modular Multilevel Converter Based on Finite Element Method
Implications of Ageing Through Power Cycling on the Short-Circuit Robustness of 1.2-kV SiC mosfets
Thermal Performance Evaluation of 1500-VDC Photovoltaic Inverters Under Constant Power Generation Operation
Mission-Profile-Based Lifetime Prediction for a SiC mosfet Power Module Using a Multi-Step Condition-Mapping Simulation Strategy
Loss and Thermal Modeling of Metal Oxide Varistors (MOV) Under Standard Current Surge Mission Profile
SiC MOSFET vs SiC/Si Cascode short circuit robustness benchmark
Implications of short-circuit events on power cycling of 1.2-kV/20-A SiC MOSFET power modules
Wear-out evolution analysis of multiple-bond-wires power modules based on thermo-electro-mechanical FEM simulation
Impact of device aging in the compact electro-thermal modeling of SiC power MOSFETs
Proof-of-Concept for a Kelvin-Emitter On-Chip Temperature Sensor for Power Semiconductors
Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires
Evaluating IGBT temperature evolution during short circuit operations using a TSEP-based method
Guest Editorial: Special Section on Modeling, Design, and Application of Next-Generation Power Components
Modeling of IGBT With High Bipolar Gain for Mitigating Gate Voltage Oscillations During Short Circuit
Enhancement of Thermo-mechanical Behavior of IGBT Modules through Engineered Threshold Voltages
Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition
Comparative study of wire bond degradation under power and mechanical accelerated tests
Reliability Analysis of a 3-leg 4-wire Inverter under Unbalanced Loads and Harmonic Injection
Highly Reliable Package using Cu Particles Sinter Paste for Next Generation Power Devices
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