Published in
Springer, Journal of Materials Science: Materials in Electronics, 18(30), p. 17040-17045, 2019
DOI: 10.1007/s10854-019-02050-0
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Comparative study of wire bond degradation under power and mechanical accelerated tests
Journal article published in 2019 by
V. N. Popok 
,
S. Buhrkal-Donau,
B. Czerny,
G. Khatibi,
H. Luo,
F. Iannuzzo ,
K. B. Pedersen
,
S. Buhrkal-Donau,
B. Czerny,
G. Khatibi,
H. Luo,
F. Iannuzzo ,
K. B. Pedersen
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