Omkar Gupte - Dissemin

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All papers authored by Omkar Gupte

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2023 Vidya Jayaram

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, Omkar Gupte

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, Karan Bhangaonkar, Chandrasekharan Nair

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A Review of Low-Temperature Solders in Microelectronics Packaging

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2022 Omkar Gupte

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, Gregorio Murtagian, Mohanalingam Kathaperumal, Rao Tummala, Vanessa Smet

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Solid-state diffusion studies of lead-free solders on gold and in polymer films

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2021 Omkar Gupte

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, Gregorio Murtagian, Rao Tummala, Vanessa Smet

Effect of latching force on socketed BGA packages with Ni-Au coated solder spheres

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2020 Omkar Gupte

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, Gregorio Murtagian, Rao Tummala, Vanessa Smet

Thermal aging reliability of socketable, surface-modified solder BGAs with and without polymer collars

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Omkar Gupte

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, Gregorio Murtagian, Rao Tummala

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Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres

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Omkar Gupte

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, Gregorio Murtagian, Rao Tummala

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Thermal aging reliability of socketable BGA packages with Ni-Au coated SAC305 spheres

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2019 Omkar Gupte

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, Kristie Teoh, Rao Tummala, Gregorio Murtagian, Vanessa Smet

Innovative Socketable and Surface-Mountable BGA Interconnections

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2018 Mathew Boban, Kevin Golovin, Brian Tobelmann, Omkar Gupte

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, Joseph M. Mabry, Anish Tuteja

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Smooth, All-Solid, Low-Hysteresis, Omniphobic Surfaces with Enhanced Mechanical Durability

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