Xiaodong Jian
The Fifth Electronics Research Institute of the Ministry of Industry and Information Technology
12 papers found
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Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints
Download from doi.orgResearch on the Mechanical Failure Risk Points of Ti/Cu/Ti/Au Metallization Layer
Download from doi.orgRelaxor Ferroelectric Capacitors Embrace Polymorphic Nanodomains
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