Researcher
Riko I. Made
Institute of Materials Research and Engineering
Statistics
20 papers found
All papers authored by Riko I. Made
Refreshing results…
Nipun Kumar Gupta 
,
Yilin Guo ,
Soon Yee Chang,
Jing Lin ,
Zi Hui Jonathan Khoo ,
Riko I. Made ,
Zi En Ooi ,
Carina Yi Jing Lim ,
Chow Hern Lee ,
M. Sivapaalan,
Yee-Fun Lim ,
Edwin Khoo ,
Lu Wen Feng,
Yanwei Lum,
Albertus D. Handoko
Download from doi.org
,
Yilin Guo ,
Soon Yee Chang,
Jing Lin ,
Zi Hui Jonathan Khoo ,
Riko I. Made ,
Zi En Ooi ,
Carina Yi Jing Lim ,
Chow Hern Lee ,
M. Sivapaalan,
Yee-Fun Lim ,
Edwin Khoo ,
Lu Wen Feng,
Yanwei Lum,
Albertus D. Handoko
Download from doi.org
2023
Yang Bai ,
Zi Hui Jonathan Khoo ,
Riko I. Made ,
Huiqing Xie,
Carina Yi Jing Lim ,
Albertus Denny Handoko ,
Vijila Chellappan ,
Jianwei Jayce Cheng ,
Fengxia Wei ,
Yee‐Fun Lim ,
Kedar Hippalgaonkar
,
Zi Hui Jonathan Khoo ,
Riko I. Made ,
Huiqing Xie,
Carina Yi Jing Lim ,
Albertus Denny Handoko ,
Vijila Chellappan ,
Jianwei Jayce Cheng ,
Fengxia Wei ,
Yee‐Fun Lim ,
Kedar Hippalgaonkar
Closed‐Loop Multi‐Objective Optimization for Cu–Sb–S Photo‐Electrocatalytic Materials’ Discovery
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David Kohen,
Xuan Sang Nguyen ,
Sachin Yadav,
Annie Kumar,
Riko I. Made ,
Christopher Heidelberger,
Xiao Gong,
Kwang Hong Lee ,
Kenneth Eng Kian Lee,
Yee Chia Yeo ,
Soon Fatt Yoon,
Eugene A. Fitzgerald
Download from doi.org
,
Sachin Yadav,
Annie Kumar,
Riko I. Made ,
Christopher Heidelberger,
Xiao Gong,
Kwang Hong Lee ,
Kenneth Eng Kian Lee,
Yee Chia Yeo ,
Soon Fatt Yoon,
Eugene A. Fitzgerald
Download from doi.org
2013
Riko I. Made ,
Eric Jian Rong Phua,
Stevin Snellius Pramana,
Chee Cheong Wong,
Zhong Chen,
Alfred Iing Yoong Tok,
Chee Lip Gan
,
Eric Jian Rong Phua,
Stevin Snellius Pramana,
Chee Cheong Wong,
Zhong Chen,
Alfred Iing Yoong Tok,
Chee Lip Gan
Improved mechanical and thermomechanical properties of alumina substrate via iron doping
Download from dr.ntu.edu.sg
2010
Riko I. Made ,
Chee Lip Gan,
Kin Leong Pey,
Chuan Seng Tan
,
Chee Lip Gan,
Kin Leong Pey,
Chuan Seng Tan
Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface
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2009
H. L. Leong,
Chee Lip Gan,
Riko I. Made ,
Carl V. Thompson,
Kin Leong Pey,
H. Y. Li
,
Carl V. Thompson,
Kin Leong Pey,
H. Y. Li
Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects
Download from www.researchgate.net
2008
Riko I. Made ,
Chee Lip Gan,
Li Ling Yan,
Aibin Yu,
Seung Wook Yoon,
John H. Lau,
Chengkuo Lee
,
Chee Lip Gan,
Li Ling Yan,
Aibin Yu,
Seung Wook Yoon,
John H. Lau,
Chengkuo Lee
Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
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