Tiwei Wei - Dissemin

All papers authored by Tiwei Wei

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2024 Shuhang Lyu

, Qianying Wu

, Zheng Gong, Keyu Wang, Kenneth E. Goodson, Tiwei Wei

Thermomechanical Modeling and Stress Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling

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2022 Sougata Hazra

, Tiwei Wei

, Yujui Lin, Mehdi Asheghi, Kenneth Goodson, Man Prakash Gupta, Michael Degner

Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling

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Hao Chen, Tiwei Wei

, Yuxiang Chen, Xiaoling Li, Nan Li, Qiuchi Zhu, Sougata Hazra, Yue Zhao, Man Prakash Gupta, Mehdi Asheghi, Yongfeng Lu, Kenneth Goodson, Alan Mantooth

Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler

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Tiwei Wei

, Herman Oprins, Liang Fang, Vladimir Cherman, Eric Beyne, M. Baelmans

Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets

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2021 Tiwei Wei

, Herman Oprins

, Vladimir Cherman, Zhi Yang, Kathryn C. Rivera, Geert Van der Plas

, Bartlomiej J. Pawlak, Luke England, Eric Beyne, Martine Baelmans

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

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This paper is made freely available by the publisher.

2020 Tiwei Wei

All-in-one design integrates microfluidic cooling into electronic chips

Download from www.nature.com

Tiwei Wei

, Herman Oprins

, Vladimir Cherman, Eric Beyne, Martine Baelmans

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

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T. W. Wei

, H. Oprins, V. Cherman, E. Beyne, M. Baelmans

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

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2019 Tiwei Wei

, Herman Oprins

, Vladimir Cherman, Shoufeng Yang, Ingrid De Wolf

, Eric Beyne, Martine Baelmans

Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems

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Tiwei Wei

, Herman Oprins, Vladimir Cherman, Eric Beyne, Martine Baelmans

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Download from doi.org

Tiwei Wei

, Herman Oprins

, Vladimir Cherman, Jun Qian

, Ingrid De Wolf

, Eric Beyne, Martine Baelmans

High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

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Tiwei Wei

, Herman Oprins, Vladimir Cherman, Ingrid De Wolf, Eric Beyne, Martine Baelmans

First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications

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T.-W. Wei

, H. Oprins, V. Cherman, I. De Wolf, G. Van der Plas, E. Beyne, M. Baelmans

Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5D Si Interposer Packages

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T.-W. Wei

, H. Oprins, V. Cherman, G. Van der Plas, I. De Wolf, E. Beyne, M. Baelmans

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

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2018 Tiwei-W. Wei

, Herman Oprins, Vladimir Cherman, Ingrid De Wolf, Eric Beyne, Shoufeng Yang, Martine Baelmans

3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges

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This paper was not found in any repository; the policy of its publisher is unknown or unclear.

Tiwei-W. Wei

, Herman Oprins, V. Cherman, Ingrid De Wolf, Eric Beyne, Martine Baelmans

Nozzle Array Scaling Effects on the Thermal/Hydraulic Performance of Liquid Jet Impingement Coolers for High Performance Electronic Applications

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2015 Tiwei Wei

, Xing Qiu, Jeffery C. C. Lo, S. W. Ricky Lee, S. W. Ricky Lee

Wafer level bumping technology for high voltage LED packaging

Download from www.researchgate.net

2014 Tiwei Wei

, Qian Wang, Jian Cai, Le Chen, Jones Huang, Lu Wang, Long Zhang, Cheng Li

Performance and reliability study of TGV interposer in 3D integration

Download from www.researchgate.net

Tiwei Wei

, Jian Cai, Yang Hu, Qian Wang, Yang Hu, Ziyu Liu, Lu Wang, Zijian Wu, Ziyu Liu, Zijian Wu

Optimization and Evaluation of Sputtering Barrier/Seed Layer in Through Silicon Via for 3-D Integration

Download from ieeexplore.ieee.org

2012 Ziyu Liu, D. Yang, Jian Cai, Qian Wang, Tao Wang, Tiwei Wei

, K. Bi, Li Li, M. Cai

Copper chemical mechanical polishing and wafer thinning with temporary bonding for Through Silicon Via interconnect

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All papers authored by Tiwei Wei