Steve Park
steveparklab.kaist.ac.kr
0000-0002-1428-592X
KAIST
21 papers found
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Body-temperature softening electronic ink for additive manufacturing of transformative bioelectronics via direct writing
Divide and Conquer: Design of Gallium‐Based Liquid Metal Particles for Soft and Stretchable Electronics
An All‐Stretchable, Ultraviolet Protective, and Electromagnetic‐Interference‐Free E‐Textile
Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics
Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics
On-skin and tele-haptic application of mechanically decoupled taxel array on dynamically moving and soft surfaces
A Personalized Electronic Tattoo for Healthcare Realized by On‐the‐Spot Assembly of an Intrinsically Conductive and Durable Liquid‐Metal Composite
Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics
From Diagnosis to Treatment: Recent Advances in Patient-Friendly Biosensors and Implantable Devices
Numerical Simulations and In Situ Optical Microscopy Connecting Flow Pattern, Crystallization, and Thin‐Film Properties for Organic Transistors with Superior Device‐to‐Device Uniformity
Neuromorphic Processing of Pressure Signal Using Integrated Sensor-Synaptic Device Capable of Selective and Reversible Short- and Long-Term Plasticity Operation
Transparent Pressure Sensor with High Linearity over a Wide Pressure Range for 3D Touch Screen Applications
Parallel Signal Processing of a Wireless Pressure‐Sensing Platform Combined with Machine‐Learning‐Based Cognition, Inspired by the Human Somatosensory System
Meniscus-Guided Control of Supersaturation for the Crystallization of High Quality Metal Organic Framework Thin Films
Highly Uniform and Low Hysteresis Piezoresistive Pressure Sensors Based on Chemical Grafting of Polypyrrole on Elastomer Template with Uniform Pore Size
Microstructured Porous Pyramid-Based Ultrahigh Sensitive Pressure Sensor Insensitive to Strain and Temperature
Highly Ordered 3D Microstructure-Based Electronic Skin Capable of Differentiating Pressure, Temperature, and Proximity
A Highly Sensitive Bending Sensor Based on Controlled Crack Formation Integrated with an Energy Harvesting Pyramid Layer
Pressure Insensitive Strain Sensor with Facile Solution-Based Process for Tactile Sensing Applications
Inorganic Polymer Micropillar-Based Solution Shearing of Large-Area Organic Semiconductor Thin Films with Pillar-Size-Dependent Crystal Size
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