Ching-Tzu Chen
0000-0003-2260-1248
4 papers found
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Topological semimetal interface resistivity scaling for vertical interconnect applications
Guest Editorial: Dimensional Scaling of Material Functional Properties to Meet Back-End-of-Line (BEOL) Challenges
Unconventional resistivity scaling in topological semimetal CoSi
Size-Dependent Grain-Boundary Scattering in Topological Semimetals
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