Ma Haitao - Dissemin

All papers authored by Ma Haitao

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2019 Shengyan Shang, Yanfeng Wang, Yunpeng Wang, Haitao Ma

, Anil Kunwar

Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint

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Shengyan Shang, Anil Kunwar

, Yanfeng Wang, Lin Qu, Haitao Ma

, Yunpeng Wang

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

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Shengyan Shang, Anil Kunwar

, Yanfeng Wang, Jinye Yao, Yingchao Wu, Haitao Ma

, Yunpeng Wang

Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

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Shengyan Shang, Anil Kunwar

, Jinye Yao, Haitao Ma

, Yunpeng Wang

Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux

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2018 Shengyan Shang, Anil Kunwar

, Jinye Yao, Yanfeng Wang, Haitao Ma

, Yunpeng Wang

Effect of the $\text {TiO}_2$ TiO 2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints

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Shengyan Shang, Anil Kunwar

, Jinye Yao, Yunpeng Wang, Ning Zhao, Mingliang Huang, Haitao Ma

All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles

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Shengyan Shang, Anil Kunwar

, Yanfeng Wang, Xiao Qi, Haitao Ma

, Yunpeng Wang

Synthesis of Cu@Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity

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H. R. Ma

, A. Kunwar

, S. Y. Shang, C. R. Jiang, Y. P. Wang, H. T. Ma, N. Zhao

Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

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Haoran Ma, Anil Kunwar

, Jun Chen, Lin Qu, Yunpeng Wang, Xueguan Song, Peter Råback, Haitao Ma

, Ning Zhao

Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy

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Anil Kunwar

, Bingfeng Guo, Shengyan Shang, Peter Råback, Yunpeng Wang, Jun Chen, Haitao Ma

, Xueguan Song, Ning Zhao

Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

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Haoran Ma, Anil Kunwar

, Zhiyuan Liu, Jun Chen, Yunpeng Wang, Mingliang Huang, Ning Zhao, Haitao Ma

Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

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Anil Kunwar

, Shengyan Shang, Peter Råback, Yunpeng Wang, Julien Givernaud, Jun Chen, Haitao Ma

, Xueguan Song, Ning Zhao

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

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2017 Bingfeng Guo, Anil Kunwar

, Chengrong Jiang, Ning Zhao, Junhao Sun, Jun Chen, Yunpeng Wang, Mingliang Huang, Haitao Ma

Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage

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Haoran Ma, Anil Kunwar

, Ru Huang, Jun Chen, Yunpeng Wang, Ning Zhao, Haitao Ma

Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag 3 Sn particles during multiple reflows

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Haoran Ma, Yunpeng Wang, Jun Chen, Anil Kunwar

, Haitao Ma

, Ning Zhao

Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows

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Haitao Ma

, Haoran Ma, Anil Kunwar

, Shengyan Shang, Yunpeng Wang, Jun Chen, Mingliang Huang, Ning Zhao

Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows

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2014 L. Qu, H. T. Ma

, H. J. Zhao, Anil Kunwar

, N. Zhao

In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

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All papers authored by Ma Haitao