Eiji Higurashi - Dissemin

All papers authored by Eiji Higurashi

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2019 Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi

Investigation of Plasma Treatment Conditions for Wafer-Scale Room-Temperature Bonding Using Ultrathin Au Films in Ambient Air

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Takashi Matsumae

, Yuichi Kurashima, Eiji Higurashi

, Hideki Takagi

Surface activated bonding of Au/Cr, Au/Ta and Au/Pt/Ti films after degas annealing for Si/sapphire gas cell

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Seongbin Shin, Eiji Higurashi

, Tadatomo Suga

Low Temperature Copper-Copper Bonding in Ambient Air Using Hydrogen Radical Pretreatment

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Michitaka Yamamoto, Yutaka Kunimune, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi

Room-temperature pressureless wafer sealing using ultrathin Au films activated by Ar plasma

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Yuki Honda, Masahide Goto, Toshihisa Watabe, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi

, Hiroshi Toshiyoshi, Toshiro Hiramoto

Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors

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Eiji Higurashi

, Hayato Azuma, Michitaka Yamamoto, Takeshi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga

Room-Temperature Wafer Bonding with Titanium Thin Films Based on Formation of Ti/Si Amorphous Layers

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Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi

, Hideki Takagi

Room temperature bonding of smooth Au surface of electroformed Cu substrate in atmospheric air

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Ryohei Hokari

, Kazuma Kurihara

, Eiji Higurashi

, Hiroshi Hiroshima

Optical evaluation of nanocomposite metamaterials fabricated by nano-printing technique utilizing silver nanoink

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Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Toshihiro Miyake, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi

Wafer-scale Au-Au surface activated bonding using atmospheric-pressure plasma

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Ryo Takigawa, Toru Tomimatsu, Eiji Higurashi

, Tanemasa Asano

Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method

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Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

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Masahide Goto

, Yuki Honda

, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi

, Eiji Higurashi

, Hiroshi Toshiyoshi

, Toshiro Hiramoto

Quarter Video Graphics Array Digital Pixel Image Sensing With a Linear and Wide- Dynamic-Range Response by Using Pixel-Wise 3-D Integration

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Seongbin Shin, Eiji Higurashi

, Kohta Furuyama, Michitaka Yamamoto, Tadatomo Suga

X-ray Photoelectron Spectroscopy (XPS) Analysis of Oxidation Behavior of Hydrogen-radical-treated Cu Surfaces

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M. Yamamoto, T. Matsumae, Y. Kurashima, H. Takagi, T. Suga, T. Itoh, E. Higurashi

Growth behavior of au films on SiO2 film and direct transfer for smoothing au surfaces

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2018 Nobutomo Morita, Wataru Iwasaki, Hirofumi Nogami, Fumiya Nakashima, Eiji Higurashi

, Renshi Sawada

Hematocrit-insensitive Absolute Blood Flow Rate Measurement in 0.5-mm-diameter Flow Channel Using MEMS-based Laser Doppler Velocimeter with Signal Modification for Detecting Beat Frequency from Broad Power Spectrum

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Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi

Surface analysis of argon and oxygen plasma-treated gold for room temperature wafer scale gold-gold bonding

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Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi

, Hiroshi Toshiyoshi, Toshiro Hiramoto

Pixel-Parallel 3D Integrated CMOS Image Sensors Developed by Direct Bonding of SOI Layers for Next-Generation Video Systems

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Renshi Sawada, Hirofumi Nogami, Eiji Higurashi

Progress and Perspective of Optical MEMS Packaging Technology

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Fengwen Mu, Miyuki Uomoto, Takehito Shimatsu, Yinghui Wang, Kenichi Iguchi, Haruo Nakazawa, Yoshikazu Takahashi, Eiji Higurashi

, Tadatomo Suga

De-bondable SiC-SiC wafer bonding via an intermediate Ni nano-film

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Ryo Takigawa, Eiji Higurashi

, Tanemasa Asano

Surface Activated Bonding of LiNbO3 and GaN at Room Temperature

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All papers authored by Eiji Higurashi