Anil Kunwar
www.mendeley.com
0000-0003-4295-5772
KU Leuven
50 papers found
Refreshing results…
Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag 3 Sn particles during multiple reflows
Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows
Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows
Quantitative polynomial free energy based phase field model for void motion and evolution in Sn under thermal gradient
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage
Effects of Cu nanoparticles doped flux on the microstructure of IMCs between Sn solder and Cu substrate
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints
Positive feedback on imposed thermal gradient by interfacial bubbles in Cu/liquid Sn-3.5Ag/Cu joints
The study of the growth behavior of Cu6Sn5 at the Sn/Cu interface during the heating preservation stage
The morphology variation of IMC on the solder/bubble interface under different cooling rates and temperatures
Modelling the melting of Sn0.7Cu solder using the enthalpy method
In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stage
Erratum to: Modeling the diffusion-driven growth of a pre-existing gas bubble in molten tin
On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
On the increase of intermetallic compound's thickness at the cold side in liquid sn and snag solders under thermal gradient
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper
Modeling the diffusion-driven growth of a pre-existing gas bubble in molten tin
In situ aging study on the variation of Sn0.7Cu/Cu solid interface marked by bubbles
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