Anil Kunwar - Dissemin

All papers authored by Anil Kunwar

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2023 Oktawian Bialas

, Augustine N. S. Appiah

, Marta Wala

, Anil Kunwar

, Anna Woźniak, Paweł M. Nuckowski, Wojciech Simka

, Peter Råback, Marcin Adamiak

Laser assisted fabrication of mechanochemically robust Ti3Au intermetallic at Au-Ti interface

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2019 Shengyan Shang, Yanfeng Wang, Yunpeng Wang, Haitao Ma

, Anil Kunwar

Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint

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Shengyan Shang, Anil Kunwar

, Yanfeng Wang, Lin Qu, Haitao Ma

, Yunpeng Wang

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

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Shengyan Shang, Anil Kunwar

, Yanfeng Wang, Jinye Yao, Yingchao Wu, Haitao Ma

, Yunpeng Wang

Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

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Shengyan Shang, Anil Kunwar

, Jinye Yao, Haitao Ma

, Yunpeng Wang

Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux

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2018 Anil Kunwar

, Haoran Ma, Haitao Ma, Junhao Sun, Ning Zhao, Mingliang Huang

Corrigendum to “On the increase of intermetallic compound’s thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215]

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Shengyan Shang, Anil Kunwar

, Jinye Yao, Yanfeng Wang, Haitao Ma

, Yunpeng Wang

Effect of the $\text {TiO}_2$ TiO 2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints

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Bingfeng Guo, Ru Huang, Jinye Yao, Xiao Qi, Anil Kunwar

, Yunpeng Wang, Haitao Ma

Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints

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Shengyan Shang, Anil Kunwar

, Yanfeng Wang, Jinye Yao, Haitao Ma, Yunpeng Wang

Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints

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Anil Kunwar

, Shengyan Shang, Peter Raback, Xueguan Song, Prafulla Bahadur Malla, Yunpeng Wang, Haitao Ma

A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes

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Shengyan Shang, Anil Kunwar

, Jinye Yao, Yunpeng Wang, Ning Zhao, Mingliang Huang, Haitao Ma

All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles

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Shengyan Shang, Anil Kunwar

, Yanfeng Wang, Xiao Qi, Haitao Ma

, Yunpeng Wang

Synthesis of Cu@Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity

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H. R. Ma

, A. Kunwar

, S. Y. Shang, C. R. Jiang, Y. P. Wang, H. T. Ma, N. Zhao

Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

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Haoran Ma, Anil Kunwar

, Jun Chen, Lin Qu, Yunpeng Wang, Xueguan Song, Peter Råback, Haitao Ma

, Ning Zhao

Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy

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Anil Kunwar

, Peter Raback, Shengyan Shang, Prafulla Bahadur Malla, Xueguan Song, Yunpeng Wang, Haitao Ma

A Computational Model for Simulation of Temperature During Radio-Frequency Ablation of Biological Tissue

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Bingfeng Guo, Anil Kunwar

, Ning Zhao, Jun Chen, Yunpeng Wang, Haitao Ma

Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

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Anil Kunwar

, Bingfeng Guo, Shengyan Shang, Peter Råback, Yunpeng Wang, Jun Chen, Haitao Ma

, Xueguan Song, Ning Zhao

Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

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Haoran Ma, Anil Kunwar

, Zhiyuan Liu, Jun Chen, Yunpeng Wang, Mingliang Huang, Ning Zhao, Haitao Ma

Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

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Anil Kunwar

, Shengyan Shang, Peter Råback, Yunpeng Wang, Julien Givernaud, Jun Chen, Haitao Ma

, Xueguan Song, Ning Zhao

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

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2017 Bingfeng Guo, Anil Kunwar

, Chengrong Jiang, Ning Zhao, Junhao Sun, Jun Chen, Yunpeng Wang, Mingliang Huang, Haitao Ma

Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage

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All papers authored by Anil Kunwar