Ning Zhao
0000-0001-5509-4989
Dalian University of Technology (大连理工大学)
5 papers found
Refreshing results…
Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy
Effect of Zn content on Cu–Ni cross-interaction in Cu/Sn–xZn/Ni micro solder joints
Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient
Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect
Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition
Missing publications? Search for publications with a matching author name.