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All papers authored by Mark Kushner

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2024 Florian Krüger

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, Mark J. Kushner

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Voltage waveform tailoring for high aspect ratio plasma etching of SiO2 using Ar/CF4/O2 mixtures: Consequences of low fundamental frequency biases

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2022 Florian Krüger

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, Hyunjae Lee, Sang Ki Nam

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, Mark J. Kushner

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Voltage waveform tailoring for high aspect ratio plasma etching of SiO₂ using Ar/CF₄/O₂ mixtures: Consequences of ion and electron distributions on etch profiles

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Yao Du

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, Florian Krüger

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, Hoki Lee, Suyoung Yoo, Jacob Eapen

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, Mark J. Kushner

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, Steven Shannon

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Comparison of glancing-angle scatterings on different materials in a high aspect ratio plasma etching process using molecular dynamics simulation

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I. Adamovich

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, S. Agarwal, E. Ahedo

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, P. J. Bruggeman

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, C. Canal, E. H. Choi, S. Coulombe

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and 26 other authors

The 2022 Plasma Roadmap: low temperature plasma science and technology

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2021 Xifeng Wang

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, Hyunjae Lee, Sang Ki Nam

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, Mark J. Kushner

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Erosion of focus rings in capacitively coupled plasma etching reactors

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Florian Krüger

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, Hyunjae Lee, Sang Ki Nam

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, Mark J. Kushner

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Electric field reversals resulting from voltage waveform tailoring in Ar/O₂ capacitively coupled plasmas sustained in asymmetric systems

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2020 Chenhui Qu

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, Steven J. Lanham

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, Steven C. Shannon

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, Mark J. Kushner

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Erratum: Power Matching to Pulsed Inductively Coupled Plasmas [J. Appl. Phys. 127, 133302 (2020)]

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Chenhui Qu, Sang Ki Nam

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, Mark J. Kushner

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Transients using low-high pulsed power in inductively coupled plasmas

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Chenhui Qu

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, Steven J. Lanham

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, Steven C. Shannon

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, Mark J. Kushner

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Power matching to pulsed inductively coupled plasmas

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Vladimir Volynets, Yuri Barsukov

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, Gonjun Kim, Ji-Eun Jung, Sang Ki Nam

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, Kyuhee Han, Shuo Huang

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, Mark J. Kushner

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Highly selective Si3N4/SiO2 etching using an NF3/N2/O2/H2 remote plasma. I. Plasma source and critical fluxes

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Ji-Eun Jung, Yuri Barsukov

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, Vladimir Volynets, Gonjun Kim, Sang Ki Nam

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, Kyuhee Han, Shuo Huang

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, Mark J. Kushner

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Highly selective Si3N4/SiO2 etching using an NF3/N2/O2/H2 remote plasma. II. Surface reaction mechanism

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Shuo Huang

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, Seungbo Shim, Sang Ki Nam

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, Mark J. Kushner

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Pattern dependent profile distortion during plasma etching of high aspect ratio features in SiO2

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2019 Amanda M. Lietz

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, Xavier Damany, Eric Robert

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, Jean-Michel Pouvesle, Mark J. Kushner

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Ionization wave propagation in an atmospheric pressure plasma multi-jet

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Shuo Huang

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, Seungbo Shim, Sang Ki Nam

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, In-Cheol Song, Siqing Lu, Mark J. Kushner

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Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation

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2018 Sandra Schröter

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, Apiwat Wijaikhum

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, Andrew R. Gibson

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, Helen L. Davies

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, Nicolas Minesi

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, James Dedrick

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, Erik Wagenaars

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, Nelson de Oliveira, Laurent Nahon, Mark J. Kushner

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, Jean-Paul Booth

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, Deborah O'Connell

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Chemical kinetics in an atmospheric pressure helium plasma containing humidity

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