Khai Ngo
0000-0002-0326-3055
Virginia Tech
95 papers found
Refreshing results…
Package influence on the simulated performance of 1.2 kV SiC modules
A novel energy storage for PFC by EV motor/generator
A 50 kW SiC three-phase AC-DC converter design for high temperature operation
Model for Electromagnetic Actuator With Significant Fringing Using Minimal Fitting Parameters
Power inductors in silicon
An ultra-fast SiC phase-leg module in modified hybrid packaging structure
Exploration of a switching loop snubber for parasitic ringing suppression
Loss minimization for coupled inductors with significant AC flux
Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere
Dielectric strength of Al2O3/silicone composites after high-temperature aging
DOE SBIR PHASE II. High-temperature Packaging of Planar Power Modules by Low-temperature Sintering of Nanoscale Silver Paste
Direct-Bond-Copper Switch Module for Management of Temperature and Noise in 220-W/in3 Power Assembly
A frequency-domain study on the effect of DC-link decoupling capacitors
Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste
A 99%-efficiency 1-MHz 1.6-kW zero-voltage-switching boost converter using normally-off GaN power transistors and adaptive dead-time controlled gate drivers
High current and high frequency planar inductor loss measurement and analysis
Integrated power passives
Low-temperature sintering of a nanosilver paste for attaching large-area power chips
Development of a 1200 V, 120 A SiC MOSFET module for high-temperature and high-frequency applications
High Efficiency Minichannel and Mini-Impingement Cooling Systems for Hybrid Electric Vehicle Electronics
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