Chi-Yang Yu - Dissemin

All papers authored by Chi-Yang Yu

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2019 Chang Liu, Bing-Hong Chen, Wei-Ren Liu

, Jenq-Gong Duh

Synthesis and theoretical calculations of N-doped ZnCo2O4 anode for lithium-ion anode via gradient pressure-induced processes and theoretical calculations

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2015 Wei-Yu Chou, Yi-Chun Jin, Jenq-Gong Duh

, Cheng-Zhang Lu, Shih-Chieh Liao

A facile approach to derive binder protective film on high voltage spinel cathode materials against high temperature degradation

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Qi Bao, Yao-Hui Huang, Chun-Kai Lan, Bing-Hong Chen, Jenq-Gong Duh

Scalable Upcycling Silicon from Waste Slicing Sludge for High-performance Lithium-ion Battery Anodes

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Hao Yang, Chun-Kai Lan, Jenq-Gong Duh

The power of Nb-substituted TiO2 in Li-ion batteries: Morphology transformation induced by high concentration substitution

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2014 Jia-Hong Chu, Joseph Lee, Chun-Chi Chang, Yu-Chen Chan, Ming-Li Liou, Jyh-Wei Lee, Jason Shian-Ching Jang, Jenq-Gong Duh

Antimicrobial characteristics in Cu-containing Zr-based thin film metallic glass

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Wei-Yu Chen, Wei Tu

, Hsiang-Ching Chang, Tzu-Ting Chou, Jenq-Gong Duh

Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints

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Wei-Yu Chen, Chi-Yang Yu, Jenq-Gong Duh

Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compounds

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Wen-Lin Chen, Chi-Yang Yu, Cheng-Ying Ho, Jenq-Gong Duh

Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

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Cheng-Ying Ho, Jenq-Gong Duh

Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength

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Chien-Fu Tseng, Cheng-Ying Ho, Joseph Lee, Jenq-Gong Duh

Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint

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Cheng-Ying Ho, Meng-Ting Tsai

, Jenq-Gong Duh

, Jyh-Wei Lee

Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies

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2013 Yi-Hsin Wu, Chi-Yang Yu

, Cheng-Ying Ho, Jenq-Gong Duh

Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer

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Wei-Quan Shao, Chi-Yang Yu

, Wen-Cai Lu, Jenq-Gong Duh, Sha-Ou Chen

Study of the Zn occupancy leading to the stability improvement for Cu6Sn5 using a first-principles approach

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2012 Shao-Wei Fu, Chi-Yang Yu

, Tae-Kyu Lee, Kuo-Chuan Liu, Jenq-Gong Duh

Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn–Ag–Cu/Ni solder joints

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Chi-Yang Yu

, Wei-Yu Chen, Jenq-Gong Duh

Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

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Chi-Yang Yu

, Jenq-Gong Duh

Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging

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Wei-Yu Chen, Chi-Yang Yu

, Jenq-Gong Duh

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

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2011 Chi-Yang Yu

, Jenq-Gong Duh

Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints

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Yi-Da Tsai, Chi-Yang Yu

, Chi-Chang Hu, Jenq-Gong Duh

Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping

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2010 Chi-Yang Yu

, Tae-Kyu Lee, Michael Tsai, Kuo-Chuan Liu, Jenq-Gong Duh

Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures

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All papers authored by Chi-Yang Yu