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TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems
UploadHigh Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors
Download from ieeexplore.ieee.orgEnergy-Efficient Encoding for High-Speed Serial Interfaces
UploadSkyrmionic interconnect device
UploadEnergy-Efficient Time-Based Adaptive Encoding for Off-Chip Communication
UploadMiniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications
UploadFabrication Cost Analysis for Contactless 3-D ICs
UploadThe MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems
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