Published in
Springer (part of Springer Nature), Journal of Materials Science: Materials in Electronics, 1(29), p. 589-601
DOI: 10.1007/s10854-017-7951-x
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Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage
Journal article published in 2017 by
Bingfeng Guo,
Anil Kunwar 
,
Chengrong Jiang,
Ning Zhao,
Junhao Sun,
Jun Chen,
Yunpeng Wang,
Mingliang Huang,
Haitao Ma
,
Chengrong Jiang,
Ning Zhao,
Junhao Sun,
Jun Chen,
Yunpeng Wang,
Mingliang Huang,
Haitao Ma
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