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2017 18th International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2017.8046606

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In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage

Proceedings article published in 2017 by Bingfeng Guo, Chengrong Jiang, Anil Kunwar ORCID, Jun Chen, Ning Zhao, Yunpeng Wang, Haitao Ma
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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