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2017 18th International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2017.8046631

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Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage

Proceedings article published in 2017 by Bingfeng Guo, Chengrong Jiang, Anil Kunwar ORCID, Ning Zhao, Jun Chen, Yunpeng Wang, Haitao Ma
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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