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2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

DOI: 10.1109/nordpac.2017.7993186

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Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials

Proceedings article published in 2017 by Maulik Satwara, Josef Hansson ORCID, Lilei Ye, Henric Rhedin, Johan Liu
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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