Published in
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
DOI: 10.1109/ectc.2017.65
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Thermal Bond Reliability of High Reliability New Palladium-Coated Copper Wire
Proceedings article published in 2017 by
Motoki Eto,
Tomohiro Uno,
Teruo Haibara,
Ryo Oishi,
Takashi Yamada,
Tetsuya Oyamada
