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2017 International Caribbean Conference on Devices, Circuits and Systems (ICCDCS)

DOI: 10.1109/iccdcs.2017.7959714

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Scalable models to represent the via-pad capacitance and via-traces inductance in multilayer PCB high-speed interconnects

Proceedings article published in 2017 by Abraham Isidoro-Munoz, Reydezel Torres-Torres ORCID, Miguel A. Tlaxcalteco-Matus, Gaudencio Hernandez-Sosa
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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