Dissemin is shutting down on January 1st, 2025

Published in

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015

DOI: 10.1109/epeps.2015.7347150

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

DOI: 10.1109/edaps.2016.7874429

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Performace modeling and optimization for on-chip interconnects in memory arrays

Proceedings article published in 2015 by Javaneh Mohseni, Chenyun Pan, Azad Naeemi ORCID
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

Full text: Unavailable

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