Published in
2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO)
DOI: 10.1109/nano.2016.7751333
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Investigation the plating and wetting ability of reactive sputtered Molybdenum-Tungsten multi-layers for advanced Cu metallization
Proceedings article published in 2016 by
Tai-Chen Kuo,
Tzu-Lang Shih,
Yin-Hsien Su,
Wen-Hsi Lee,
Wei-Hsiang Liao
