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2016 12th International Congress Molded Interconnect Devices (MID)

DOI: 10.1109/icmid.2016.7738924

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A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

Journal article published in 2016 by Jan Vanfleteren ORCID, Frederick Bossuyt, Bart Plovie, Ieee
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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