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2016 17th International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2016.7583168

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The morphology variation of IMC on the solder/bubble interface under different cooling rates and temperatures

Proceedings article published in 2016 by Haoran Ma, Anil Kunwar ORCID, Zhixian Meng, Bingfeng Guo, Ning Zhao, Haitao Ma
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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