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2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

DOI: 10.1109/s3s.2017.8309242

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Heterogeneous integration toward monolithic 3D chip

Proceedings article published in 2017 by SangHyeon Kim, Seong-Kwang Kim, Jae-Phil Shim, Dae-Myeong Geum, Gunwu Ju, Han Sung Kim ORCID, Hee Jung Lim, Hyeong Rak Lim, Jae-Hoon Han, ChangMo Kang, Dong Seon Lee, Jin Dong Song, Won Jun Choi, Hyung-Jun Kim
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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