Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 3(8), p. 473-481, 2018
DOI: 10.1109/tcpmt.2018.2794438
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Wideband Electromagnetic Model and Analysis of Shielded-Pair Through-Silicon Vias
Journal article published in 2018 by
Chenguang Liao,
Zhangming Zhu 
,
Qijun Lu ,
Xiaoxian Liu ,
Yintang Yang
,
Qijun Lu ,
Xiaoxian Liu ,
Yintang Yang
This paper was not found in any repository, but could be made available legally by the author.
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