Trans Tech Publications, Materials Science Forum, (885), p. 269-274
DOI: 10.4028/www.scientific.net/msf.885.269
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Considering the size of the natural appearance of the micro alloy components of a SAC solder joint, AFM was used to investigate their mechanical properties in the form of their natural appearance. Contact-mode point-spectroscopy was done to determine the elastic modulus and tapping-mode point-spectroscopy was done to investigate the tip-sample power dissipation.The measured Young’s modulus values of the Cu, IML, Ag3Sn and Sn components, were 125±9 GPa, 111±20 GPa, 67±11 GPa and 57±16 GPa, respectively. The dissipation measurements were accomplished by Si and diamond probes with different spring constants. The different characteristics of the results are discussed.