Published in
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
DOI: 10.1109/iitc-amc.2016.7507685
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- ORCID
- Institute of Electrical and Electronics Engineers
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Contacts for monolithic 3D architecture: Study of Ni0.9Co0.1 silicide formation
Proceedings article published in 2016 by
P.-H. Rodriguez 
,
S. Favier,
F. Nemouchi,
C. Sese,
F. Deprat,
C. Fenouillet-Beranger,
P. Gergaud
,
S. Favier,
F. Nemouchi,
C. Sese,
F. Deprat,
C. Fenouillet-Beranger,
P. Gergaud
This paper is available in a repository.
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