Published in
Elsevier, Journal of Alloys and Compounds, (696), p. 799-807
DOI: 10.1016/j.jallcom.2016.12.037
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Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles
Journal article published in 2017 by
Yanni Wen 
,
Xiuchen Zhao ,
Zhuo Chen,
Yue Gu ,
Yong Wang,
Zhiwei Chen ,
Xinyuan Wang
,
Xiuchen Zhao ,
Zhuo Chen,
Yue Gu ,
Yong Wang,
Zhiwei Chen ,
Xinyuan Wang
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