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Published in

Materials Research Society, Materials Research Society Symposium Proceedings, (769), 2003

DOI: 10.1557/proc-769-h6.8

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Evolution of Nanocrystalline Silicon Layers Deposited at 150°C for Thin Film Transistor Channels

Journal article published in 2003 by I.-Chun Cheng ORCID, Steven Allen, Sigurd Wagner
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

Full text: Unavailable

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Abstract

AbstractThin film transistors of nanocrystalline silicon (nc-Si:H) are made in the staggered topgate, bottom-source/drain geometry. To achieve both high carrier mobility and low off current, the nc-Si:H channel material must be kept thin but comprise a contiguous 10-nm thick crystalline layer at its top. We study this electrically most interesting top layer of the nc-Si:H channel film by AFM and SEM. Introducing an nc-Si:H seed layer underneath the TFT promotes the structural evolution of the nc-Si:H channel layer and raises the electron field effect mobility up to 40 cm2V-1s-1.